This is a one of TIM (Thermal Interface Material) that is inserted between components to efficiently dissipate the heat inside electronic equipment.
Usage image diagram
Fill it between a heat generating element and the cooling device such as a heat sink, and use it after hardening.
・Since it is a liquid when mounted, it is easy to get into gaps and adhere closely.
・If the gap between the heat source part and the cooling device is different, it can be handled by adjusting the filling amount.
・No load is applied to the heat generating element