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- Gap filler
Gap filler
This is a one of TIM (Thermal Interface Material) that is inserted between components to efficiently dissipate the heat inside electronic equipment.
Usage image diagram
Fill it between a heat generating element and the cooling device such as a heat sink, and use it after hardening.
Merit
・Since it is a liquid when mounted, it is easy to get into gaps and adhere closely.
・If the gap between the heat source part and the cooling device is different, it can be handled by adjusting the filling amount.
・No load is applied to the heat generating element
Products handled
■Silicone type
This is a silicone gap filler with thermal conductivity, flame retardancy, and electrical insulation.
By forming a flexible joint surface that can relieve stress and filling in fine unevenness on the contact surface, it enhances the cooling effect.
Its flexibility and heat resistance are better than other materials, and the product lineup is extensive.
■Non-silicone type
This is a non-silicone gap filler with thermal conductivity, flame resistance, and electrical insulation.
By forming a flexible joint surface that can relieve stress and filling in fine unevenness on the contact surface, it enhances the cooling effect.
Since it does not use silicon material, it can be used in places where outgassing of low-molecular-weight siloxane is a concern.